Embedded World, On-Device Voice AI, Digi Acquires Particle: Embedded Week Insights
Here’s a roundup of this week’s must-read articles – we’ll delve into the latest developments unveiled at Embedded World, on-device voice AI, and Digi's acquisition of Particle. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Infineon Adds 400-MHz Option to AURIX TC3x Automotive MCUs…
Embedded World, On-Device Voice AI, Digi Acquires Particle: Embedded Week Insights
Here’s a roundup of this week’s must-read articles – we’ll delve into the latest developments unveiled at Embedded World, on-device voice AI, and Digi's acquisition of Particle. Also, check News Archives – Embedded…
13.03.2026 19:00
👍 0
🔁 0
💬 0
📌 0
Qualinx’s Digital RF Architecture Simplifies GNSS Chip Design
The digital RF architecture delivers a reconfigurable GNSS chip that integrates more functionality directly on-chip.
Qualinx’s Digital RF Architecture Simplifies GNSS Chip Design
The digital RF architecture delivers a reconfigurable GNSS chip that integrates more functionality directly on-chip.
13.03.2026 14:50
👍 0
🔁 1
💬 0
📌 0
MediaTek Unveils Genio Chipsets for IoT
MediaTek Inc. has unveiled a range of new Genio chipset platforms at embedded world 2026, targeting a range of IoT products and applications. These system-on-chip (SoC) platforms include the Genio Pro, Genio 420, and Genio 360. The Genio Pro series is the premium offering for high-performance IoT and embedded, while the Genio 420 and Genio 360 platforms deliver system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.
MediaTek Unveils Genio Chipsets for IoT
MediaTek Inc. has unveiled a range of new Genio chipset platforms at embedded world 2026, targeting a range of IoT products and applications. These system-on-chip (SoC) platforms include the Genio Pro, Genio 420, and Genio 360. The Genio Pro series is the…
12.03.2026 15:24
👍 0
🔁 0
💬 0
📌 0
Digi Launches SOM Platform for Connected Products
Digi International has introduced its Digi ConnectCore 95 integrated platform, powered by NXP’s i.MX 95 applications processor, for developing intelligent connected devices. These system-on-modules (SOMs) combine intelligent device hardware, integrated cloud, wireless connectivity, security, over-the-air (OTA) capabilities, and built-in fleet management. Building on its device-to-cloud capabilities through the recent acquisition of Particle, Digi can now deliver complete IoT solutions for intelligent edge hardware, secure connectivity, and large-scale device lifecycle management.
Digi Launches SOM Platform for Connected Products
Digi International has introduced its Digi ConnectCore 95 integrated platform, powered by NXP’s i.MX 95 applications processor, for developing intelligent connected devices. These system-on-modules (SOMs) combine intelligent device hardware,…
12.03.2026 13:46
👍 0
🔁 0
💬 0
📌 0
On-Device Voice AI: Turning Speech into the New Keyboard
SLMs drive the shift to on-device voice AI.
On-Device Voice AI: Turning Speech into the New Keyboard
SLMs drive the shift to on-device voice AI.
11.03.2026 18:47
👍 0
🔁 0
💬 0
📌 0
Renesas 365 Development Platform Supports RA MCUs
Renesas announces the general availability of the development platform at embedded world 2026.
Renesas 365 Development Platform Supports RA MCUs
Renesas announces the general availability of the development platform at embedded world 2026.
11.03.2026 18:35
👍 0
🔁 0
💬 0
📌 0
NXP Integrates AI and Tri-Radio in the i.MX 93W Processor
A high-level of integration replaces about 60 discrete components in a single package.
NXP Integrates AI and Tri-Radio in the i.MX 93W Processor
A high-level of integration replaces about 60 discrete components in a single package.
11.03.2026 14:44
👍 0
🔁 0
💬 0
📌 0
Infineon Adds 400-MHz Option to AURIX TC3x Automotive MCUs
The new 400 MHz variants increase real-time processing headroom for automotive control and ADAS systems.
Infineon Adds 400-MHz Option to AURIX TC3x Automotive MCUs
The new 400 MHz variants increase real-time processing headroom for automotive control and ADAS systems.
10.03.2026 21:22
👍 0
🔁 0
💬 0
📌 0
AMD Powers SolidRun’s COM Express Type 6 Modules
COM Express Type 6 modules target rugged edge AI systems in mission-critical environments.
AMD Powers SolidRun’s COM Express Type 6 Modules
COM Express Type 6 modules target rugged edge AI systems in mission-critical environments.
09.03.2026 17:50
👍 0
🔁 0
💬 0
📌 0
Nordic Adds Entry-Level Bluetooth LE SoCs
These BLE SoCs can function as the main wireless SoC or operate as BLE companion devices.
Nordic Adds Entry-Level Bluetooth LE SoCs
These BLE SoCs can function as the main wireless SoC or operate as BLE companion devices.
09.03.2026 17:04
👍 0
🔁 0
💬 0
📌 0
Digi Acquires Particle to Extend Embedded IoT Reach
Acquisition expands Digi’s embedded-as-a-service IoT portfolio, enabling customers to build IoT solutions faster.
Digi Acquires Particle to Extend Embedded IoT Reach
Acquisition expands Digi’s embedded-as-a-service IoT portfolio, enabling customers to build IoT solutions faster.
06.03.2026 15:41
👍 0
🔁 0
💬 0
📌 0
Embedded Systems Are Pivotal to Smart Factories
Embedded systems are central to the next evolution of smart factories.
Embedded Systems Are Pivotal to Smart Factories
Embedded systems are central to the next evolution of smart factories.
03.03.2026 16:03
👍 0
🔁 0
💬 0
📌 0
A CHERI on Top: A Better Way to Build Embedded Secure SoCs
Hardware-enforced memory safety strengthens security, simplifies functional safety and even reduces firmware size.
A CHERI on Top: A Better Way to Build Embedded Secure SoCs
Hardware-enforced memory safety strengthens security, simplifies functional safety and even reduces firmware size.
03.03.2026 14:47
👍 0
🔁 0
💬 0
📌 0
Siemens Agentic Toolkit Automates Chip Verification Workflows
Industry is converging on a future where chip design and verification are heavily assisted by AI orchestration.
Siemens Agentic Toolkit Automates Chip Verification Workflows
Industry is converging on a future where chip design and verification are heavily assisted by AI orchestration.
27.02.2026 16:48
👍 0
🔁 0
💬 0
📌 0
Linaro, Arm Launch CoreCollective Open Consortium
Linaro Ltd. has launched CoreCollective, a new industry consortium designed to advance open collaboration across the Arm software ecosystem. Backed by Arm, membership is free and open to any company involved in building, testing, or deploying workloads on Arm. CoreCollective is hosted by Linaro, which provides organizational and engineering leadership, and receives financial backing from Arm. The consortium builds on over 15 years of Linaro's work accelerating Arm-based solutions, spanning Linux, firmware, security, cloud, edge computing, IoT, AI, automotive, virtualization, toolchains, and major platforms, including Windows on Arm and Android.
Linaro, Arm Launch CoreCollective Open Consortium
Linaro Ltd. has launched CoreCollective, a new industry consortium designed to advance open collaboration across the Arm software ecosystem. Backed by Arm, membership is free and open to any company involved in building, testing, or deploying…
26.02.2026 22:04
👍 0
🔁 0
💬 0
📌 0
MIPI Alliance Upgrades Specs for JEDEC UFS
The MIPI Alliance has released two major updates to its UniPro and M-PHY specifications, targeting JEDEC Universal Flash Storage (UFS 5.0) for edge AI in mobile, PC, and automotive applications. The new MIPI UniPro v3.0 and MIPI M-PHY v6.0 versions offer performance, latency, and power-efficiency improvements for JEDEC UFS 5.0 solutions to support edge AI workloads in smartphones, tablets, PCs, gaming consoles, automotive, and industrial applications.
MIPI Alliance Upgrades Specs for JEDEC UFS
The MIPI Alliance has released two major updates to its UniPro and M-PHY specifications, targeting JEDEC Universal Flash Storage (UFS 5.0) for edge AI in mobile, PC, and automotive applications. The new MIPI UniPro v3.0 and MIPI M-PHY v6.0 versions offer…
24.02.2026 17:38
👍 0
🔁 0
💬 0
📌 0