3月27日(金)12時50分～17時00に、エレクトロニクス実装学会 #JIEP 関西支部が第23回技術講演会「AI社会のキーテクノロジー『光電融合と光回路実装技術』」を開催。講演6件。
講演会後に名刺交換会。大阪市浪速区・大阪公立大学I-Siteなんばにて。詳細は buff.ly/GH5c1b1 に。
#Seminar #CPO #CoPackagedOptics #OpticalPackaging

AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 part.1 AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 part.1 | グローバルネット株式会社はあらゆる半導体関連情報を提供いたします。エッチング／バンプウエハ／CMPなどのウエハ受託加工、世界半導体市場年鑑／世界半導体製造装置市場年鑑を始めとした半導体、有機ELの調査レポートの販売を行っております。

10月22日（水）と11月26日（水）に、グローバルネット㈱がセミナー『AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 〜日本メーカーの役割とグローバル競争を勝ち抜く鍵〜』の Part 1 とPart 2 を開催。東京都千代田区・プラザエフにて。Part 1 はオンラインでも開催。Part 2 は懇親会を含む。詳細は bit.ly/4q6LDdB と bit.ly/3KL3Fls に。
#Seminar #AI #Chiplet #CoPackagedOptics #CPO #GlassSubstrate

11月7日(金)13:20-17:45に、エレクトロニクス実装学会 #JIEP 光回路実装技術(OPT)研究会が第88回OPT公開研究会『いよいよ本格化する Co-packaged optics (CPO) 技術最前線』を開催。講演4件。東京都江東区・産業技術総合研究所およびオンラインにて。詳細は bit.ly/4nILyL5 に。
#Seminar #OpticalPackaging #CoPackagedOptics #CPO

Lumentum aims to surpass $600 million in quarterly revenue by June 2026, driven by accelerating AI-related demand.

#LITE #Lumentum #LITEStock #LITENews #LITEStockNews #LumentumStock #LumentumNews #LumentumStockNews #AIChips #LaserChips #OpticalCircuitSwitch #CoPackagedOptics #EMLChips
$LITE

Onsemi’s Treo Platform, Co-Packaged Optics, Time Sensitive Networking: Embedded Week Insights Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Onsemi's Treo Platform, Co-Packaged Optics, and Time Sensitive Networking! Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Alice & Bob Unveils Dynamiqs-NVIDIA CUDA-Q Synergy, Pushing Quantum Simulation Speeds to New Heights…

Onsemi's #TreoPlatform, #CoPackagedOptics, #TimeSensitiveNetworking: #Embedded Week Insights

The Rise of Co-Packaged Optics The insatiable hunger for interconnection bandwidth is one of the key trends shaping data centers’ evolution, driven by the unstoppable growth of Internet traffic and the aggressive scaling of AI Large Language Models. Increased bandwidth, however, usually comes at the price of increased power, definitely an unwanted side effect in the era of skyrocketing data centers’ energy consumption: it’s worth reminding that a single Nvidia rack is expected to draw as much as 600 kilowatts in 2027.

The Rise of #CoPackagedOptics #COP #datacenters #optics

Advancing Co-Packaged Optics: Sarcina Technology Redefines Photonic Packaging for AI-Era Data Centers Sarcina Technology, a leader in semiconductor and photonic package design, has unveiled significant advancements in its photonic packaging capabilities for Co-Packaged Optics (CPO), targeting core challenges faced by data centers amid the exponential growth of AI-driven data. Sarcina’s innovative approach to photonic package design is setting the stage for a new generation of high-bandwidth, high-data-rate, and low-power interconnects. As traditional copper interconnects struggle to meet the performance, power, and density demands of next-generation…

Advancing #CoPackagedOptics: Sarcina Technology Redefines #Photonic Packaging for #AI Era #DataCenters

Co-Packaged Optics Reaches Power Efficiency Tipping Point But blazing fast data speeds come with significant manufacturing challenges.

Commercialization has started for network switches based on CPO, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical testing strategies.
semiengineering.com/co-packaged-...
#copackagedoptics #CPO #datacenter

AMD Acquires Enosemi to Drive Next-Gen Co-Packaged Optics for Scalable AI Infrastructure AMD has announced the acquisition of Enosemi, a strategic move aimed at accelerating innovation in co-packaged optics for next-generation AI systems. This acquisition represents a pivotal advancement in AMD’s fast-evolving AI roadmap. Enosemi, having previously worked with AMD as an external development partner in the photonics domain, now formally joins the company to expand AMD’s internal capabilities. As part of AMD, Enosemi’s team will play a central role in scaling the development and deployment of photonics and co-packaged optics solutions to meet the demands of emerging AI infrastructure.

#AMD Acquires #Enosemi to Drive Next-Gen #CoPackagedOptics for Scalable #AI Infrastructure

NVIDIA Remains Cautious on Optical Chips, Praising Copper Connections for Reliability - WinBuzzer NVIDIA CEO Jensen Huang has expressed doubts about optical chip reliability.

NVIDIA Remains Cautious on Optical Chips, Praising Copper Connections for Reliability

#NVIDIA #IBM #OpticalChips #AIHardware #CoPackagedOptics #AI #Semiconductors #DataCenters